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The following is a brief description of the basic process of laying the floor.
The basis of the parquet floor lies in the cutting and splicing of various shapes of wood chips, so it is required that the cutting of the wood chips must be precise, and the various shapes should be spliced ​​together according to the original drawings. In order to achieve the excellence of chip cutting size, users in the floor parquet industry currently use laser machine (JQ1412 servo screw JQ1290 belt conveyor) for cutting wood chips. The laser machine utilizes the fine characteristics of the laser beam to meet the high precision requirements of the floor mosaic. There will also be some gaps after the wood chip is cut and spliced, so some fine wood residue is needed. Then it needs to be processed by grinding and compression.
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